The Model 7072 Semiconductor Matrix Card is designed specifically to handle low-level and high-impedance measurements encountered in semiconductor parametric tests on wafers and devices. This unique design provides two low-current circuits with specified 1pA maximum offset current for sensitive sub-picoamp measurement resolution and two C-V paths for measurement of Capacitance Voltage characteristics from DC to 1MHz. Four additional high-quality signal paths with <20pA offset current provide for general-purpose signal switching up to 100nA or 200V. Connections are 3-lug triax with the outer shell connected to chassis for safety and noise shielding. The center conductor is fully surrounded by the inner conducting shield, so that fully guarded measurements can be made to achieve higher isolation and to improve measurement speed and accuracy. Isolation relays on the low-current and C-V paths automatically disconnect unused circuits to achieve minimum interference and peak performance. The 707A or 708A mainframe allows each row (signal path) to be programmed for Break-Before-Make or Make-Before-Break operation. For applications requiring connections to a large number of devices or test points, the 7072 matrix can be expanded with additional cards. The low-current and C-V rows can be extended to other cards with coaxial jumpers. The other four high-quality signal paths connect directly to the 707A backplane for expansion.